NordPac 2019

The conference NordPac is a collaboration between IMAPS Nordic and IEEE Electronics Pacakaging Society (EPS) Nordic. NordPac 2019 will take place in Lyngby at Technical University of Denmark. The conference addresses itself to the following topics:

– Printed, flexible electronics
– Medical electronics
– Unique materials, PTF and ACF
– OPTO-ELECTRICAL and LED
– High temperature electronics, harsh environment
– Sensor integration & applications
– 3D Advanced interconnect, advanced packaging
– Wearable electronics
– Ceramics: thick film, copper plated, DBC, LTCC
– Reliability assessments, SPC and FMEA

You are welcome to submit an abstract online: https://www.conftool.com/nordpac2019. The deadline for the final paper is May 22nd, but if you want your paper to be reviewed, deadline is May 1st. Late papers are not published. All approved and reviewed papers will be included in the conference proceedings and submitted for inclusion to IEEE Xplore Digital Library (www.ieeexplore.ieee.org) after the authors’ approval. The paper must be original and not previously published. Avoid inclusion of commercial content. The paper should be 4-10 pages. For students we have the possibility to have papers classified as Reviewed and published in both IEEE Xplore and IMAPS North America IMAPSource, see http://ieeexplore.ieee.org and http://www.imapsource.org.