55th International Symposium on Microelectronics

The 55th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS) and held at Hynes Convention Center. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, Medical electronics markets, and beyond!

Abstracts are rated by the technical committee members and are selected into the sessions by the session chairs appointed by the technical committee. Authors should identify their preferred session (topical area) when submitting their abstracts. Abstracts should highlight the major contributions of the work in one or more of these areas. All abstracts submitted must represent original, previously unpublished work.

The technical programm track is planed as followed:

TRACK 1: Manufacturing Optimization

• CPI & Modeling
• PDK Development for Packaging
• Assembly Process Integration
• Yield Advancement
• Cost Reduction & Tradeoffs
• Throughput & Cycle Time
• Design for Manufacturing
• Reliability & Test

TRACK 2: Wafer Level/Panel Level (Advanced RDL)

• Wafer-level Fan Out / WLCSP
• Advanced Fan Out & Heterogeneous Integration
• Panel-level Fan Out
• MEMS & Sensors
• Edge Protection
• Carrier Technologies
• Reliability & Test
• Df/Dk Loss Tangent of Dielectrics

TRACK 3: High Performance / High Reliability

• High Reliability in Defense and Aerospace
• High Reliability in Automotive
• MM Wave / High-speed Packaging
• RF / Wireless Components
• HiRel in Bio/Medical
•HiRel in Extreme Environments

TRACK 4: Advanced Package (Flip Chip, 2.5D, 3D, Optical)

• Large Body / Small Body FC
• 2.5D/3D Technologies
• Optical / Photonics / Waveguides / Lasers
• BUMP & Interconnect
• 3D Technologies
• Advanced Flip Chip
• Heterogeneous Integration

TRACK 5: Advanced Process & Materials (Enabling Tech.)

• Substrate Technology
• Polymer Materials & Processes
• Novel Materials & Processes
• Advanced Wirebond
• Advanced Equipment for Additive Manufacturing
• Flexible & Wearable Electronics