The 23rd Annual IMAPS Device Packaging Conference (DPC 2027) will be held in Phoenix, Arizona, on March 1-4, 2027. It is an international event organized by […]
Im Dezember 2026 wird in Indien zum ersten Mal die Fachkonferenz IEEE-IDSPS (Indian Global Semiconductors to Systems, Research & Technology Conference) ausgetragen. Sie ist von IMAPS […]
Am 3. Dezember 2026 öffnet die 3. Leistungselektronikfachtagung an der Hochschule für Angewandte Wissenschaften Kiel ihre Türen. Auch in diesem Jahr erwartet die Besucherinnen und Besucher […]
The RF, Microwave and Photonics Packaging (RaMPoP) Conference 2026 will take place on November 26, 2026, at the Compound Semiconductor Applications Catapult in Newport, United Kingdom. […]
MicroTech 2027 is the Annual IMAPS-UK Conference. This In Person Conference combines invited Keynotes and presentations from leading Industrial Companies and Research Organisations. The Conference will […]
We are pleased to open the call for papers of the 20th Advanced Technology Workshop on Micropackaging and Thermal Management that will be held in La […]
The 47th IMAPS Poland Conference, held jointly with the 18th International Conference on Optical and Electronic Sensors (COE), will take place from September 20–23, 2026, in Bukowina Tatrzańska, Poland. Organized […]
The 12th IMAPS Flash Conference 2026 will take place on October 22–23, 2026, in Zlín, Czech Republic, under the theme “Comprehensive Semiconductor Analysis.” Organized by the […]
The 59th International Symposium on Microelectronics (IMAPS Symposium 2026), organized by the International Microelectronics Assembly and Packaging Society (IMAPS), will take place from September 28 to October […]
The 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026) will take place from 9 to 11 September 2026 in Helsinki, Finland. As the flagship IEEE […]
The 25th International Conference on Electronics Packaging (ICEP-HBS2026) will be held at the International Conference Center Hiroshima from April 14 to 18, 2026. The conference will […]