MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum” will be held in Grenoble, France, at the WTC congress center from June 19-20, 2024. MiNaPAD is […]

Pack4EU’s core objective is to assess the current status of packaging, assembly, and test facilities in Europe. Additionally, it aims to analyze the evolving needs of […]

The International Microelectronics Assembly and Packaging Society (IMAPS) will host an International Conference on Advanced Packaging for Power Electronics on May 8-9 in Boston-Woburn. The Conference […]

Following the success of the Power Electronics Workshop organized over the past 14 years in partnership with GREMAN (UMR 7347) and Polytech-Tours, sponsored by ST-Microelectronics, CERTeM […]