November 21, 2023

MiNaPAD 2024

MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum” will be held in Grenoble, France, at the WTC congress center from June 19-20, 2024. MiNaPAD is […]
November 16, 2023

ICEP 2024

ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong […]
Oktober 24, 2023

IMAPS Frühjahrsseminar 2024

Am 20. Februar 2024 findet wieder unser alljährliches IMAPS Frühjahsseminar statt. An der Technischen Hochschule Ingolstadt werden neue Einblicke rund um das Thema „Elektronik für das […]