THERMAL 2027

We are pleased to open the call for papers of the 20th Advanced Technology Workshop on Micropackaging and Thermal Management that will be held in La Rochelle on March 17 and 18, 2027. This yearly conference has grown year after year by the number of presented papers and attendees. Be part of a successful 2026 edition and be sure to submit your abstract on time. The workshop sessions will include the following topics. Papers are invited in following areas:

• Cooling solutions for microelectronics packaging,
• Heat conductive materials at chip, board, sub-system and system levels,
• Advances in PCBs for thermal management, PCB embedded components included,
• Heatsinks, heat pipes and change phase materials,
• Liquid and phase change cooling,
• Thermal modeling and simulation, Machine Learning and AI optimization,
• Innovative cooling solutions,
• Thermal management of optoelectronics components (LEDs, IR sensors…),
• Overviews or examples of products, systems cooling, power electronics, automotive transport,
• Temperature-related or thermal cycles-related reliability of electronic components

Speakers will submit 200-300 words abstract detailing their presentation (20 minutes + 5 minutes for  questions), no later than 5th, January 2027. Speakers pay a reduced registration fee (including MERCURE hotel accommodation for 2 nights and meals)  and are also requested to attend the entire workshop to maximize opportunities of exchanging with other  attendees and exhibitors.

Notification of acceptance by the Technical Committee: 20th, January 2027.  After notification of acceptance, you commit to attend the workshop or delegate someone else.

Please respond to IMAPS by e-mail: imaps.france@orange.fr

International Microelectronics Assembly and Packaging Society –France 17 rue de l’Amiral Hamelin 75016 Paris