The 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024) is the premier international event in the field of electronics packaging and system integration. The conference […]

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the […]

IMAPS Nordic richtet vom 11. bis 13. Juni 2024 die Microelectronics Packaging Conference and Exhibition, NordPac 2024, in Tampere, Finnland aus. Die Veranstaltung bringt sowohl Akademiker […]

The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development […]