The 25th International Conference on Electronics Packaging (ICEP-HBS2026) will be held at the International Conference Center Hiroshima from April 14 to 18, 2026. The conference will […]
IMAPS Nordic would like to welcome you to the IMAPS Nordic Microelectronics Packaging Conference and Exhibition, NordPac 2026, in Stockholm, Sweden. The event brings together both […]
Im Herbst 2026 veranstaltet IMAPS Deutschland erneut die Jahreskonferenz zu aktuellen Themen der Aufbau- und Verbindungstechnik in allen Anwendungsfeldern. Die Konferenz bietet eine wichtige Plattform für […]
The Centre for Power Electronics (CPE) Annual Conference will bring together the Power Electronics, Machines and Drives Community to review the latest Research and Development that […]
The Electronics for Extreme Environments 2026 Conference focuses on “Electronics That Must Endure”. This in-person Conference combines invited Keynotes, Presentations and Posters from leading Industrial Companies, […]
MicroTech 2026 is the Annual IMAPS-UK Conference which, this year, focuses on “Driving Innovation in Semiconductor Packaging”. This in-person Conference combines invited Keynotes, Presentations and Posters […]
The IMAPS Italy Workshop on Photonic Packaging will take place on November 4–5, 2025, at the Politecnico di Milano – Bovisa campus. The event brings together […]
Digitalisierung und Künstliche Intelligenz bestimmen viele Entwicklungen in Beruf und Alltag. Doch ob es sich um Handys, Computer, Daten- und Energieströme oder viele Innovationen im Gesundheitsbereich […]
Die Fachtagung „Elektronische Baugruppen und Leiterplatten (EBL)“ bietet eine hochkarätige Plattform für Fachleute aus Industrie, Forschung und Entwicklung, um aktuelle Trends, Technologien und Herausforderungen im Bereich […]
Following the success of the Power Electronics Workshop organized over the past 15 years in partnership with GREMAN (UMR 7347) and Polytech-Tours, sponsored by ST-Microelectronics, CERTeM […]