IMAPS Symposium 2024

The 57th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society ( IMAPS) and held in Boston, Massachusetts.

This year’s program features 5 technical tracks, plus our Interactive Poster Session. The technical program will span three days of sessions with emphasis on Design, Modeling and Manufacturing; Fanout, RDL, WLP / PLP; High Performance / High Reliability; Advanced Package (Flip Chip, 2.5D, 3D, Optical); Advanced Process & Materials (Enabling Technology).

Technical sessions are being planned for these tracks, and abstracts will be considered on the session topic listed above. Abstracts are rated by the technical committee members and are selected into the sessions by the session chairs appointed by the technical committee. Authors should identify their preferred session (topical area) when submitting their abstracts. Abstracts should highlight the major contributions of the work in one or more of these areas. All abstracts submitted must represent original, previously unpublished work.