The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development […]

We are pleased to open the call for papers of the 17th Advanced Technology Workshop on Micropackaging and Thermal Management which will be held in Poitiers […]

MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum” will be held in Grenoble, France, at the WTC congress center from June 19-20, 2024. MiNaPAD is […]

ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong […]