IMAPS (US) High Temperature, CICMT, and Power Packaging Conferences come together for a great opportunity for you…..one location, one registration, and three times the content, networking, […]

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The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and […]

We are pleased to open the call for papers of the 18th Advanced Technology Workshop on Micropackaging and Thermal Management that will be held in La […]

The 21st Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6, 2025. It is an international event organized by the […]

MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum” will be held in Grenoble, France, at the WTC congress center from June 19-20, 2024. MiNaPAD is […]

Pack4EU’s core objective is to assess the current status of packaging, assembly, and test facilities in Europe. Additionally, it aims to analyze the evolving needs of […]

The International Microelectronics Assembly and Packaging Society (IMAPS) will host an International Conference on Advanced Packaging for Power Electronics on May 8-9 in Boston-Woburn. The Conference […]

Following the success of the Power Electronics Workshop organized over the past 14 years in partnership with GREMAN (UMR 7347) and Polytech-Tours, sponsored by ST-Microelectronics, CERTeM […]

The Centre for Power Electronics (CPE) Annual Conference will bring together the Power Electronics, Machines and Drives Community to review the latest Research and Development that will […]

Im Herbst jeden Jahres veranstaltet IMAPS Deutschland eine Jahreskonferenz zu aktuellen Themen der Aufbau- und Verbindungstechnik in allen Anwendungsfeldern. Für die Sicherung, Stärkung und Weiterentwicklung des […]