The 57th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society ( IMAPS) and held in Boston, Massachusetts. This year’s program […]

The 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024) is the premier international event in the field of electronics packaging and system integration. The conference […]

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the […]

IMAPS Nordic richtet vom 11. bis 13. Juni 2024 die Microelectronics Packaging Conference and Exhibition, NordPac 2024, in Tampere, Finnland aus. Die Veranstaltung bringt sowohl Akademiker […]

The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development […]

We are pleased to open the call for papers of the 17th Advanced Technology Workshop on Micropackaging and Thermal Management which will be held in Poitiers […]

MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum” will be held in Grenoble, France, at the WTC congress center from June 19-20, 2024. MiNaPAD is […]

ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong […]

Following the success of the Power Electronics Workshop organized over the past 13 years in partnership with GREMAN (UMR 7347) and Polytech-Tours, sponsored by ST-Microelectronics, CERTeM […]

The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an international event organized by the International […]

Am 17. April 2024 wird an der Hochschule Landshut das 4. Symposium Elektronik und Systemintegration (ESI 2024) stattfinden. Das Symposium ESI bietet eine technologien- und branchenübergreifende […]