Pack4EU’s core objective is to assess the current status of packaging, assembly, and test facilities in Europe. Additionally, it aims to analyze the evolving needs of […]

The International Microelectronics Assembly and Packaging Society (IMAPS) will host an International Conference on Advanced Packaging for Power Electronics on May 8-9 in Boston-Woburn. The Conference […]

Following the success of the Power Electronics Workshop organized over the past 14 years in partnership with GREMAN (UMR 7347) and Polytech-Tours, sponsored by ST-Microelectronics, CERTeM […]

The Centre for Power Electronics (CPE) Annual Conference will bring together the Power Electronics, Machines and Drives Community to review the latest Research and Development that will […]

Im Herbst jeden Jahres veranstaltet IMAPS Deutschland eine Jahreskonferenz zu aktuellen Themen der Aufbau- und Verbindungstechnik in allen Anwendungsfeldern. Für die Sicherung, Stärkung und Weiterentwicklung des […]

The 57th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society ( IMAPS) and held in Boston, Massachusetts. This year’s program […]

The 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024) is the premier international event in the field of electronics packaging and system integration. The conference […]

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the […]

IMAPS Nordic richtet vom 11. bis 13. Juni 2024 die Microelectronics Packaging Conference and Exhibition, NordPac 2024, in Tampere, Finnland aus. Die Veranstaltung bringt sowohl Akademiker […]

The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development […]

We are pleased to open the call for papers of the 17th Advanced Technology Workshop on Micropackaging and Thermal Management which will be held in Poitiers […]

MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum” will be held in Grenoble, France, at the WTC congress center from June 19-20, 2024. MiNaPAD is […]