Dezember 14, 2023
We are pleased to open the call for papers of the 17th Advanced Technology Workshop on Micropackaging and Thermal Management which will be held in Poitiers […]
November 21, 2023
MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum” will be held in Grenoble, France, at the WTC congress center from June 19-20, 2024. MiNaPAD is […]
November 16, 2023
ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong […]
Oktober 24, 2023
Am 20. Februar 2024 findet wieder unser alljährliches IMAPS Frühjahrsseminar statt, dieses Mal an der Technischen Hochschule Ingolstadt: Esplanade 10 85049 Ingolstadt Raum E003 (E Gebäude, […]
Oktober 16, 2023
Following the success of the Power Electronics Workshop organized over the past 13 years in partnership with GREMAN (UMR 7347) and Polytech-Tours, sponsored by ST-Microelectronics, CERTeM […]
September 20, 2023
The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an international event organized by the International […]
September 20, 2023
Am 17. April 2024 wird an der Hochschule Landshut das 4. Symposium Elektronik und Systemintegration (ESI 2024) stattfinden. Das Symposium ESI bietet eine technologien- und branchenübergreifende […]
Mai 17, 2023
Welche Technologie erfüllt die technischen Anforderungen und bietet wettbewerbsfähige Herstellkosten? Welche neuen Möglichkeiten und Kombinationen haben sich bewährt? Im Rahmen des Workshops werden führende Vertreter aus […]
Mai 16, 2023
Vom 5. bis 6. März 2024 öffnet in der Schwabenhalle Fellbach die 12. DVS/GMM Fachtagung ihre Tore. Die Besucher*innen erwarten aktuelle Vorträge zum Thema „Elektronische Baugruppen […]
März 15, 2023
The 45th IMAPS Poland Conference 2023 will be held from September 24 to 27, 2023. The Conference is organized by IMAPS Poland Chapter and Rzeszów University […]
Januar 24, 2023
The International Microelectronics Assembly and Packaging Society (IMAPS) will host an International Conference on Advanced Packaging for Power Electronics on April 18-20 in Albuquerque, New Mexico. […]
Januar 24, 2023
HiTEC 2023 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under […]