HiTEC 2023

International Conference and Exhibition on High Temperature Electronics

HiTEC 2023 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics Assembly and Packaging Society, HiTEC 2023 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

Abstracts being requested include the following topics:

Applications:
- Geothermal
- Oil well logging
- Automotive
- Military/aerospace
- Space
Device Technologies:
- Si, SOI
- SiC
- Diamond
- GaN
- AlN
- Contacts
- Dielectrics
MEMS and Sensors:
- Vibration
- Pressure
- Seismic

Packaging:
- Materials
- Processing
- Solders/Brazes
- Substrates
- Wire Bonding
- Flip Chip
- Insulation
- Thermal management
Circuits:
- Analog
- Digital
- Power
- Wireless
- Mixed Signal

Energy Sources:
- Batteries
- Nuclear
- Fuel Cells
- Passives:
  - Resistors
  - Inductors
  - Capacitors
  - Oscillators
  - Connectors
- Reliability & Modeling:
  - AI Machine Learning
  - Failure mechanisms
  - Co-Design
  - Prognostics & Health Management

Those wishing to present at the HiTEC Conference must submit a ~250 word abstract electronically no later NOVEMBER 15, 2022, using the online submission form at: www.imaps.org/hitec. A optional Final Manuscript of 4-8pages, two-column format is due February 15, 2023, for all accepted abstracts. Please contact Brian Schieman by email at bschieman@imaps.org if you have questions. A Proceedings DOWNLOAD containing the conference papers will be distributed to all attendees during the Conference. Speakers are required to pay a reduced registration fee.