ICEP-HBS 2026

The 25th International Conference on Electronics Packaging (ICEP-HBS2026) will be held at the International Conference Center Hiroshima from April 14 to 18, 2026. The conference will take place in conjunction with the IEEE EPS Hybrid Bonding Symposium (HBS), with the HBS special session serving as the opening event of ICEP-HBS2026. This session will deliver groundbreaking insights into advanced bonding technologies.

Under the theme “Toward a Sustainable AI Computing Era,” ICEP seeks to collaborate with major international conferences worldwide, accelerating the connection between region-specific technologies and the global community while providing a robust platform for advancing semiconductor packaging technologies.

Organized by the Japan Institute of Electronics Packaging (JIEP) and co-sponsored by IEEE EPS, IEEE EPS Japan Chapter, SMTA, and IMAPS, ICEP traces its origins back to the International Microelectronics Conference (IMC) launched in 1980, adopting its current name in 2001.

ICEP-HBS2026 continues to establish itself as a premier international conference in electronics packaging, bringing together leading experts from industry, academia, and research institutions. With more than 280 oral and poster presentations – the largest number in ICEP history – the conference offers a comprehensive forum for researchers and engineers to address emerging challenges and future directions in the field.

Conference topics span advanced packaging, design and modeling, reliability, emerging technologies, high-speed wireless components, thermal management, interconnections, materials, optoelectronics, and power electronics. Long-standing partners including iNEMI, IMAPS, IMPACT, ISMP, and SMTA will present regional technology trends, complemented by dedicated sessions from EPTC, ICEPT, and MEF.