IEEE ESTC 2026

The 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026) will take place from 9 to 11 September 2026 in Helsinki, Finland. As the flagship IEEE EPS conference in Europe, co-sponsored by IMAPS Europe, IEEE ESTC 2026 offers a premier platform for the electronics packaging and system integration community and will be the largest conference in the region in 2026.

Call for Papers – Share your expertise!

Don’t miss your chance to be part of IEEE ESTC 2026! Submit your abstract for an oral or poster presentation by March 1, 2026 via the online submission system and present your work to a global audience. Abstracts are limited to a maximum of 600 words and may include up to two figures.

Topics include, but are not limited to:

• Advanced Packaging
• Materials for Interconnects and Packaging
• Optoelectronic Systems Packaging
• Assembly and Manufacturing Technologies
• Design Tools and Modeling
• Power Electronics System Packaging
• Advanced Technologies for Emerging Systems
• Reliability of Electronic Devices and Systems
• Flexible, Printed and Hybrid Electronics
• RF, mm-wave and THz Systems Packaging

Why participate?

IEEE ESTC 2026 offers a high-quality conference program with inspiring keynotes, oral and poster presentations, Professional Development Courses (PDCs), special sessions, a panel discussion, and an accompanying exhibition. The conference also provides excellent opportunities for international exchange and networking with experts from academia and industry. All accepted contributions will be published in IEEE Xplore, ensuring high visibility for your work. To support young researchers, up to 20 IEEE ESTC Student Travel Awards will be granted to students with accepted papers or posters. In addition, exceptional papers and posters will be honored with the Best Paper Award and the Best Poster Paper Award, each including a €500 cash prize.

For full details on the Call for Papers and submission process, please visit the conference website.