ESTC 2020 goes virtual!

The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS Europe. This international event brings together both academics and industry leaders to present and discuss the state-of-the-art as well as the future trends in electronics packaging and integration technologies. ESTC offers excellent opportunities for knowledge exchange and networking with international experts in the field.

The ESTC focuses on the following topics:

• Advanced Packaging
• Materials for Interconnects and Packaging
• Optoelectronic Systems Packaging
• Assembly and Manufacturing Technologies
• MEMS/NEMS and Sensors Packaging
• Design Tools and Modeling
• Power Electronic Systems Packaging
• Advanced Technologies for Emerging Systems
• Reliability of Electronic Devices and Systems
• Flexible Printed and Hybrid Electronics

As a response to the pandemic COVID-19 situation, ESTC 2020 moves to a 100% virtual platform, and the conference will be carried out live! You are therefore welcome to attend, independent of what travel restrictions may apply in September. The live format will allow interaction similar to an in-person conference. The digital format will give new possibilities, such as recording of presentations allowing to catch up presentations in parallel sessions. While the Executive Committee regrets that we cannot this time welcome you physically to beautiful Vestfold and the “Electronic Coast” of Norway, we are delighted to welcome you to an innovative, high-quality and broad-reaching ESTC 2020, 15-18 September! Details about registration are expected to be available before the end of June 2020.