August 19, 2019
Microlectronics Packaging for Harsh Environments is an IMAPS-UK technical conference covering the latest developments for microelectronic devices used in space, defence, aerospace, medical, energy & exploration […]
August 19, 2019
The 5th IMAPS flash Conference 2019 will be held from October 24th to 25th, 2019 at Brno University of Technology (FEEC, Department of Microelectronics). The conference […]
August 19, 2019
The 43rd IMAPS Poland Conference 2019 will take place at the Conference Centre of Wrocław University of Science and Technology from September 4th to 6th, 2019. […]
Juni 19, 2019
In der Studie „Sensor Technologien 2022“ beschreibt der AMA Verband für Sensorik und Messtechnik Zukunftstrends der Sensorik. Neben Silizium, dem bekanntesten Ausgangsmaterial für Sensoren, rücken neue […]