The 5th IMAPS flash Conference 2019 will be held from October 24th to 25th, 2019 at Brno University of Technology (FEEC, Department of Microelectronics). The conference will be organized by IMAPS CZ & SK in cooperation with FEEC Brno University of Technology, CEITEC, Sanmina and DPS journal.
In the main part will be presented lectures by leading experts from companies, focusing on components for microelectronics PCB and SMT processes. Flash presentations of scientists will be thematically focused on areas that are related to the scope of the organizing company interest, i.e. microelectronics assembly, packaging & 3D structures, soldering & chip attachment, simulation & testing, sensors & nanostructures.
If you are interested in participating in the conference, please register here.