April 4, 2019
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development […]
April 4, 2019
Als IMAPS-Team Deutschland möchten wir an dieser Stelle auf die jährliche, im Rahmen der SEMICON EUROPA stattfindende »Advanced Packaging Conference« (APC) hinweisen, die ihren Aufruf zur […]
April 3, 2019
Januar 23, 2019
The conference NordPac is a collaboration between IMAPS Nordic and IEEE Electronics Pacakaging Society (EPS) Nordic. NordPac 2019 will take place in Lyngby at Technical University […]