CICMT 2023

The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a multi-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high-performance ceramic interconnect products for extreme environments in the automotive, aerospace, lighting, solar, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Multilayer ceramic, thin film, tape casting, thick film hybrid, direct write, and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design, and application opportunities.

The following sessions are planed:

1. Advanced materials for passive/active devices and their properties
• Microwave/mm-wave LTCC/ULTCC dielectric materials
• Ferroelectric/piezoelectric/pyroelectric/ferrite/multiferroic materials
• Sensitive ceramics/thermoelectric/electrocaloric materials
• Dielectric/ferroelectric/piezoelectric composites
• Pastes/inks/slurries for electronics

2. Material processing and device manufacturing technologies
• LTCC/HTCC and multilayer ceramic and glass processing
• Emerging ultralow temperature, room temperature processing, and cold sintering processing
• Additive manufacturing /3D printing/ direct writing
• Advanced thick film processing
• Add thin film
• Fine structuring technologies
• Emerging embedding/integration technologies

3. Design, modeling, simulation, characterization and reliability
• Metamaterials design, realization and characterization
• High frequency devices design/modeling/simulation
• Materials and devices characterization
• Material and device reliability, lifetime, and failure estimation
• Thermal management/thermal transfer simulation

4. Devices and systems for emerging applications
• Circuits, antennas, and filters for MHz, GHz and THz for communications
• Automotive/aerospace/medical electronics/optoelectronics
• Flexible/wearable electronics
• Sensors and actuators (Integrated physical/chemical/biological)
• Packaging and integration issues for MEMS and BioMEMS devices
• Batteries/fuel cells/ energy conversion systems
• Micro-reactors/micro-fluidic devices

Those wishing to present at the CICMT Conference must submit a ~250 word abstract electronically no later NOVEMBER 15, 2022, using the online submission form at: www.cicmt.org. A Final OPTIONAL Manuscript of 4-8pages, two-column format is due February 15, 2023, for all accepted abstracts. Please contact Brian Schieman by email at bschieman@imaps.org if you have questions. A Proceedings DOWNLOAD containing the conference papers will be distributed to all attendees during the Conference. Speakers are required to pay a reduced registration fee.

There will be a joint tabletop exhibition featuring companies from the HiTEC, CICMT and Power Packaging Conferences and extensive networking opportunities with the attendees from each Conference. There will be 30 total tabletops available at this conference, and the space is expected to sell out quickly. For companies wishing for broader exposure and additional benefits, we have a variety of sponsorships available with a range of options and price points. These spots are also very limited for this event. View the exhibit/sponsor prospectus. When you are ready book reserve your space, you can use the online registration or contact bschieman@imaps.org if you need assistance or a custom package.