EMPC 2025

The European Microelectronics and Packaging Conference (EMPC 2025) is the premier international conference for microelectronics packaging, owned and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS.

The conference program will focus on industrial needs and trends and on academic long-term solutions. The event brings together researchers, innovators, technologists, business and marketing managers with an interest in semiconductor packaging.

Abstracts with a maximum abstract length: 300-500 words will be welcomes until January 27, 2025.

IMAPS-France looks forward to welcoming you to the beautiful city of Grenoble in September 2025!