ESTC 2024

The 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS Europe. The 10th IEEE ESTC will be taking place in Berlin, Germany.

Conference Topics:

• Advanced Packaging
• Materials for Interconnects and Packaging
• Optoelectronic Systems Packaging
• Assembly and Manufacturing Technologies
• Design Tools and Modeling
• Power Electronics System Packaging
• Advanced Technologies for Emerging Systems
• Reliability of Electronic Devices and Systems
• Flexible, Printed and Hybrid Electronics
• RF, mm-wave and THz Systems Packaging

Abstract submission will open on December 1, 2023. Please submit a 500-word abstract through our online-submission tool at https://conftool.net/estc2024. It is also possible to optionally upload a figure.