IMAPS APPE/CICMT/HiTEC

IMAPS (US) High Temperature, CICMT, and Power Packaging Conferences come together for a great opportunity for you…..one location, one registration, and three times the content, networking, and learning! The 2025 conference will feature combined plenary and keynote presentations, along with specific technical afternoon sessions.

APPE = Advanced Packaging for Power Electronics

CICMT = Ceramic Interconnect and Ceramic Microsystems Technologies