This IMAPS-Italy workshop will include the following topics:
- Technological trends and challenges,Davide Tarsitano, Politecnico di Milano
- Salvatore COFFA, R&D General Manager Power & Discrete STMicroelectronics
- Concepts for realizing High-Voltage Power Modules by Embedding of SiC Semiconductors,
Lars Boettcher, Fraunhofer IZM, Berlin
- AQG 324 Qualification Guidelines, Thomas Harder, European Center for Power Electronics (ECPE)
Afternoon Tutorials
- ECPE-Tutorial on ´Packaging of Wide Band Gap Devices´ Parts 1 & 2
Andreas Schletz, Head of Department Packaging & Reliability at Fraunhofer Institute IISB, Erlangen
For further information please contact: info@imaps-italy.it