IMAPS Symposium 2026
The 59th International Symposium on Microelectronics (IMAPS Symposium 2026) will take place from September 28 to October 1, 2026, at the Encore Boston Harbor in Boston, Massachusetts.
Organized by the International Microelectronics Assembly and Packaging Society (IMAPS), the IMAPS Symposium offers one of the most comprehensive technical programs in microelectronics and advanced packaging. Each year, the event attracts a strong mix of returning participants and first-time attendees, including early-career packaging professionals, industry newcomers, and students. The symposium begins with Professional Development Courses, followed by three days of technical sessions.
Call for Papers
The IMAPS 2026 Technical Committee invites the submission of original, previously unpublished papers covering advancements across the entire microelectronics and packaging supply chain. Abstracts are solicited in the following areas:
- Advanced Packages & Structures (Heterogeneous Integration, HPC, AI): Market Analysis, Package-3D, Structure/Embedded, Optical/Photonics / CPO, FOWLP-Large Die, Large Body FC/MCM
- Advanced Interconnect, Bumping & Bonding Technologies: Hybrid Bonding, Flip Chip Bumping and Bonding, Wirebond Advancements, Power/Wedge Bonding, New Interconnect Methods, Thermal Compression Bonding
- High Reliability, RF/MW, MEMS/Sensors/Flexible, WLCSP, FOWLP, Novel SIP Structures, EV/eVTOL: Package – RF – 5G/6G/MMWave, MEMS/SENSORS/Flexible, Reliability/Auto, SIP, WLCSP, Small Body FOWLP
- Enabling Materials & Advanced Equipment and Processes: Substrate Technologies Including Glass, Thermal Materials, Materials Advancements, Additive Manufacturing, Advances in Equipment, Advances in Processes
- Design & Modeling, AI Enablement, CPI and Metrology: Advanced Pkg Design & Optimization, Simulation and Modeling, System Design & Architecture, AI/ML Digital Twin, Metrology, AI Enablement of Design, Modeling, Metrology
Abstracts must be submitted here by March 16, 2026.