Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum
MiNaPAD, the „Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum“ will be held in Grenoble, France, at the WTC Congress Center from 27 to 28 May, 2020.
MiNaPAD is a 2-days conference with an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community.
Abstracts are requested on the following topics:
CAD and tools for I/O placement for advanced packaging
Digital deep submicron technologies for scaling nodes, MEMS, sensors, actuators, RF miniaturization, smart system packaging and heterogeneous integration
Innovative packaging for emerging and growing applications