MiNaPAD 2026

Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum

MiNaPAD is a 2 days conference with an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:

parallel technical sessions
an exhibition
additional technical events

Grenoble – Europe’s conveniently located technology cluster for semiconductor research, design and manufacturing – easy access to Lyon (1 hour), Geneva (2 hours), Paris (3 hours by high speed train– TGV) airports.

The deadline for abstract submisson has been extended until March 20th, 2026. For more information, please contact imaps.france@orange.fr.