NordPac 2022
It is our pleasure to announce that the IMAPS Nordic & IEEE EPS Nordic 2022 Conference on Microelectronics Packaging (NordPac) will be held on-site between the 12th and the 14th of June 2022 at Chalmers University of Technology, Gothenburg, Sweden. This is the fourth time that IMAPS Nordic Chapter and IEEE EPS Nordic Chapter jointly organise this event. The NordPac conference is a strong platform that brings together academics, as well as industry leaders, to discuss and debate state-of-the-art and future trends in microelectronics components, packaging, integration, and manufacturing technologies at the Nordic, European and international scale. NordPac provides a perfect opportunity to hear the latest news and developments in the field.
You are welcome to submit an abstract and suggestion for a paper to the NordPac Conference 2022. For instructions on how to submit your abstract, please see http://nordpac.org. The deadline for abstract submission is March 1, 2022. The deadline for the final paper will be May 22, 2022, but if you want your paper to be reviewed, the deadline is May 1, 2022. Late papers are not published. The 500-word abstract can be submitted via our online system.
Proposed topics of microelectronics and packaging include:
- Optoelectronics
- Advanced Packaging
- Materials & Processes
- Power electronics
- Green Technologies
- Harsh environment Applications
- Electronics Reliability & Quality
- Medical electronics
- Wearable electronics
- Printed electronics
- Advanced packaging for MEMS & sensors & sensor systems
The Call for exhibitors can be downloaded here. Tickets for the conference can be purchased via ConfTool.
