THERMAL 2023

We are pleased to open the call for papers of the 16th Advanced Technology Workshop on Micropackaging and Thermal Management which will be held in Poitiers Futuroscope in 8th and 9th March 2023. This yearly conference has grown year after year by the number of presented papers and attendees. This 16th edition will be the opportunity to resume technical exchanges after 3 years of Covid-19 pandemic.
Be part of a successful 2023 edition and be sure to submit your abstract on time. The workshop sessions will include the following topics. Papers are invited in following areas:

• Cooling solutions for microelectronics packaging,
• Micro-cooling solutions,
• Heat conductive materials at chip, board, sub-system and system levels,
• Advances in PCBs for thermal management,
• Thermal modeling and simulation,
• Heatsinks, heat pipes and other cooling products,
• Liquid and phase change cooling,
• New cooling solutions,
• Overviews or examples of products, systems cooling, power electronics, automotive transport,
• Thermal management of optoelectronics components (LEDs, IR sensors…),
• Reliability of electronic components over extended temperature range or submitted to
  temperature variation,
• Thermal management aspects of 3D integration: thermal interface materials, dissipation from
  PCB embedded components.

Speakers will submit 200-300 words abstract detailing their presentation (20 minutes + 5 minutes for questions),
no later than 15 October 2022.

Notification of acceptance by the Technical Committee: 15 November 2022. After notification of acceptance, you commit to attend the workshop or delegate someone else. Please respond to IMAPS by e-mail: imaps.france@orange.fr