Dezember 14, 2023
We are pleased to open the call for papers of the 17th Advanced Technology Workshop on Micropackaging and Thermal Management which will be held in Poitiers […]
November 21, 2023
MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum” will be held in Grenoble, France, at the WTC congress center from June 19-20, 2024. MiNaPAD is […]
November 16, 2023
ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong […]
Oktober 24, 2023
Am 20. Februar 2024 findet wieder unser alljährliches IMAPS Frühjahrsseminar statt, dieses Mal an der Technischen Hochschule Ingolstadt: Esplanade 10 85049 Ingolstadt Raum E003 (E Gebäude, […]