Oktober 29, 2019

HiTEC 2021

HiTEC 2021, which will be held online from April 26 to 29, 2021, continues the tradition of providing the leading biennial conference dedicated to the advancement […]
Oktober 28, 2019

CICMT 2021

The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference, which will be held online from April 26 to 29, 2021, brings together a diverse set of […]
Oktober 28, 2019

EBL 2020

Die fortschreitende Digitalisierung in allen Lebensbereichen, der Ausbau der 5G-Mobilfunknetze und der Einsatz künstlicher Intelligenz sind aktuelle Themen in der öffentlichen Diskussion über den technischen Fortschritt. […]
Oktober 9, 2019

MiNaPAD 2022

MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum” will be held in Grenoble, France, at the WTC congress center from June 23-24, 2022. MiNaPAD is […]
August 19, 2019

DPC 2020

The 16th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, on March 2-5, 2020. The conference is a major forum for […]
August 19, 2019

POWER 2019

Following the success of the Power Electronics Workshop organized over the past 10 years in partnership with GREMAN (UMR 7347) and Polytech-Tours, sponsored by ST-Microelectronics, CERTeM […]
August 19, 2019

Microelectronics Packaging for Harsh Environments

Microlectronics Packaging for Harsh Environments is an IMAPS-UK technical conference covering the latest developments for microelectronic devices used in space, defence, aerospace, medical, energy & exploration […]
August 19, 2019

5th IMAPS flash Conference 2019

The 5th IMAPS flash Conference 2019 will be held from October 24th to 25th, 2019 at Brno University of Technology (FEEC, Department of Microelectronics). The conference […]
August 19, 2019

43rd IMAPS Poland Conference 2019

The 43rd IMAPS Poland Conference 2019 will take place at the Conference Centre of Wrocław University of Science and Technology from September 4th to 6th, 2019. […]