15th European Advanced Technology Workshop on Micropackaging and Thermal Management
The 15th Advanced Technology Workshop on Micropackaging and Thermal Management will be held in La Rochelle from 5 to 6 February, 2020. The Workshop will present improvements in thermal management materials, components and systems and provide innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and sub-systems. The workshop sessions will include the following topics:
Cooling solutions for microelectronics packaging
Heat conductive materials at chip, board, sub-system and system levels
Advances in PCBs for thermal management
Thermal modeling and simulation
Heatsinks, heatpipes and other cooling products
Liquid and phase change cooling
New cooling solutions
Overviews or examples of products, systems cooling, power electronics, automotive transport etc.
Thermal management of optoelectronics components (LEDs, IR sensors etc.)
Reliability of electronic components over extended temperature range and under temperature variation
Thermal management aspects of 3D integration: thermal interface materials, dissipation from PCB embedded components and hot spots, and special techniques (e.g. micro-channels)
Papers can be submitted on the topics mentioned above. Please submit a 200-300 words abstract detailing your presentation (20 minutes + 5 minutes for questions), no later than 11 October 2019.