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    HiTEC 2021

    International Conference and Exhibition on High Temperature Electronics

    HiTEC 2021, which will be held online from April 26 to 29, 2021, continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics Assembly and Packaging Society, HiTEC 2021 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

    Papers will be presented on, but not limited to, the following subjects:

    Applications: Geothermal, Oil well, logging, Automotive, Military/Aerospace, Space, etc.
    Device Technologies: Si, SOI, SiC, Diamond, GaN, GaAs, Contacts, Dielectrics
    MEMS and Sensors: Vibration, Pressure, Seismic, etc.
    Packaging: Materials, Processing, Solders/Brazes, PC Boards, Wire Bonding, Flip Chip, Insulation, Thermal Management
    Circuits: Analog, Digital, Power, Wireless, Optical
    Energy Sources: Batteries, Nuclear, Fuel Cells, etc.
    Passives: Resistors, Inductors, Capacitors, Oscillators, Connectors
    Reliability: Failure Mechanisms, Experimental and Modeling Results

    Those wishing to present a paper at the HiTEC 2021 Conference must submit a 500+ word abstract electronically until January 13, 2021. Abstracts can be uploaded here.

    New this year – a technology cross-over extravaganza! CICMT, HiTEC and Thermal & Power Solutions come together for a great opportunity for you: one location, one registration and three times the content, networking, and learning!

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    Event-Details

    Date

    26 Apr 2021 - 29 Apr 2021

    Location

    online

    Links
    Website
    Registration
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