Join IMAPS for a virtual workshop featuring six technical speakers from Henkel, Mentor, Indium, Momentive, Hexagon and Materials Center GmbH on a variety of thermal management […]
This is the fourth in a series of fundamentals of electronics packaging tutorials organised by IMAPS-UK to describe various aspects of the production of microelectronic assemblies. […]
IMAPS established the Advanced System-in-Package conference to focus exclusively on innovative SiP technology developments, solutions and business trends. Advanced SiP 2021 combines the IMAPS System-in Package […]