This Technical Workshop organised by the Design for Additive Manufacturing Network and IMAPS-UK covers “Designing the Future of Additive Manufactured Electronics” including presentations by The University of Leeds, The Manufacturing Technology Centre (MTC), Youngstown State University and Insert.
The revolution in additive manufacturing is creating new opportunities for the manufacture of electronics products instead of standard surface mount assembly on printed circuit boards. The potential benefits include miniaturisation and improved performance through integration of the electronics within the structure of the component and truly flexible manufacturing for customisable products.
However, the performance, density and reliability of high-density multilayer boards and advanced packaging techniques are significantly more advanced than what has been demonstrated to date with Additive Manufacturing technologies. This Workshop aims to generate a greater understanding of the drivers and motivation that will facilitate multidisciplinary discussions, cross-fertilisation of ideas and drive future innovation in designing for the future of additive manufacturing for electronic systems.
This is a free to join event, please register here to book a place. The event flyer can be downloaded here.
Once registered, you will receive joining instructions by e-mail 2-3 days before the event. Bookings can be accepted up to 1 hour prior to the event start.