This Professional Development Course is an opportunity for In-depth online training presented by Andy Longford of PandA Europe.
Sawing is the first and most critical step in the die processing operation. There are many variables involved in sawing process such as wafer thickness, the width of the saw streets, the metal composition of the wafer, and the die size. Factors such as blade speed, cutting patterns, or even the electrical charge carried by the DI water used can have a significant impact on the yield of the sawn dice. The wafer dicing process yield is optimised through the proper selection of the dicing blade. Failure to perform the process correctly can cause mechanical damage to the die.
The objective of this course is to introduce engineers and technicians to the basic principles and options of the various dicing methods and its functions. This course will expose the participants to the various dicing technology such as blade dicing, laser dicing and stealth dicing for both wafer and package technology. In this 4 half-day online webinar, the issues and problem solving for the various defect types and causes will be addressed. The highlights of this workshop are the case studies as well as the video presentations of the different dicing processes. It is important to understand how these techniques work to enable participants to gain a good understanding, practical experience, and continuous-improvement knowledge to be well equipped to champion the dicing process in their organisation.
This Professional Development Course will be run over 4 days in sessions of 4 hours each to provide a comprehensive review of Dicing Technology, covering the following topics:
The event flyer can be downloaded here.
The registration for the Professional Development Course on Dicing Technology is open. Tickets can be purchased here. Prices shown are exclusive of VAT:
IMAPS-UK and IMAPS Worldwide Members: £ 450
IMAPS-UK Students (Postgraduate and Undergraduate): £ 300
Non-Members: £ 650