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The 52nd International Symposium on Microelectronics will take place in the Hynes Memorial Center in Boston from September 30th to October 3rd, 2019. The Technical Committee of IMAPS seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain.
The Symposium will feature five technical tracks and one interactive poster session. The technical tracks will cover the following subjects:
– SiP/SiM (System Solutions)
– Wafer Level/Panel Level (Advanced RDL)
– High Performance / High Reliability
– Flip Chip/ 2.5D/ 3D/ Optical (Advanced Package)
– Additive Manufacturing & Enabling Technologies
Abstracts should address themselves to one or more session topics that will be focused in the technical tracks: http://www.imaps.org/imaps2019. Please send your round about 1,000-word abstract electronically only using the online submittal form. The call for abstracts already started on October 15, 2018. Please hand in your abstract not later than January 31st, 2019.