The 53rd International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2020 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will focus on the following topics:
You are invited to submit an abstract dealing with one of the above-mentioned topics until June 1st, 2020. Please upload your ~1,000-word abstract here.