IMAPS established the Advanced System-in-Package conference to focus exclusively on innovative SiP technology developments, solutions and business trends. Advanced SiP 2021 combines the IMAPS System-in Package Conference and the 3D ASIP Conference (recognized as the premier conference on 2.5/3D ICs, focused on commercialization and infrastructure). Advanced SiP 2021 offers cutting-edge presentations from scientists, technologists and business leaders across the globe in cellular, IoT, automotive, computing and networking market segments.
„Advanced SiP technology“ is an umbrella term to cover a variety of SiP subsets, such as laminate/glass/ ceramic/silicon/leadframe based SiP, Fanout SiP, Heterogeneous integration, 2.5D/3D SiP and modules. Advanced SiP 2021 covers two major segments: microelectronic system design and system integration in a package.
The current trend is to integrate a full system or subsystem in an extremely miniaturized, smaller volume package structure with high functioning system performance, mechanical reliability, thermal management and high yield manufacturability.
Advanced SiP 2021 is expected to feature two and a half days of technical sessions, panel discussions, exhibits and local networking activities. It will provide dynamic learning and technology updates on SiP trends and new engineering innovations from the industrys global SiP leaders.