The annual IMAPS Nordic microelectronics and Packaging conference and exhibition, in collaboration with IEEE EPS, will take place at Oslo Science Park. The event brand NordPac was introduced in Gothenburg in 2017 as a collaboration between IMAPS Nordic and IEEE Electronics Packaging Society (EPS) Nordic. NordPac prides itself on being a small and specialized conference where networking is easy. This year’s conference will cover the following topics:
The abstract submission deadline is January 31, 2023. Please find further information here.
The relatively small conference is a perfect venue for establishing new networks and taking care of existing ones. NordPac provides a perfect opportunity to present the latest news and developments in the field of state-of-the-art and future trends in microelectronics components, packaging, integration, and manufacturing technologies at the Nordic, European and international scale. The exhibition which is integrated with the technical program enables direct on-site commercial interaction with all participants. In addition, local technology start-ups situated in StartupLab Oslo will be invited to attend the exhibition and exhibitors‘ presentations for free, providing you with the opportunity to expand your client horizon. We will have silver and gold sponsoring options available, as well as single and double table exhibitor opportunities. Find out more information here.