The IMAPS Nordic Microelectronics Packaging Conference and Exhibition (NordPac 2027) will take place from June 8 to 10, 2027, at the Quality Hotel Tønsberg in Norway. Organized by IMAPS Nordic, the conference brings together researchers, engineers, industry experts, and technology providers to discuss the latest developments, challenges, and future trends in microelectronics packaging and related technologies.
As the 63rd event organized by IMAPS Nordic, NordPac 2027 will provide a platform for exchanging knowledge, presenting innovative research, and strengthening collaboration between academia and industry. The technical programme will cover a broad range of topics, including advanced packaging, heterogeneous integration, photonics and photonic packaging, materials and processes, thermal management, electronics reliability, sustainable electronics, medical electronics, and sensor technologies.
The conference will feature technical presentations, workshops, seminars, and a accompanying exhibition, offering participants opportunities to explore emerging technologies, exchange experiences, and establish new contacts within the international microelectronics packaging community.
Researchers and industry professionals are invited to submit abstracts presenting their latest research, technological developments, and innovative applications. NordPac 2027 offers three submission tracks:
The abstract submission deadline is January 31, 2027, with notification of abstract acceptance by February 28, 2027. Full papers must be submitted by April 30, 2027, while extended abstracts and commercial white papers are due by May 15, 2027.
Further information about the conference, submission guidelines, and registration is available on the NordPac 2027 website.