POWER 2026

Following the success of the Power Electronics Workshop organized over the past 15 years in partnership with GREMAN (UMR 7347) and Polytech-Tours, sponsored by ST-Microelectronics, CERTeM and Polytech Tours, IMAPS-France proudly announces the 16th edition of the Power Electronics and Packaging Technical Workshop to be held in Tours, France on Thursday, November 26th, 2026. The city of Tours is located along the scenic Loire Valley which is famous for its castles built along the river. The event will be held in English. Please, save the date!!

• These topics could be developed around several themes, such as:
• New materials and substrates dedicated to power electronics
• Thermal or thermo mechanical or regulatory constraints (RoHS regulation, REACH, etc…)
• Dedicated technologies for integration and optimisation of power systems, including passive components (weight and size reduction, yield improvement, efficiency, etc…)
• Innovative technologies, materials and processes dedicated to interconnection and packaging (die attach, bonding wire & ribbon wires, 3D power components, etc…)
• Reliability and failure modes (impacts linked to technologies, thermal constraints, radiation, etc…), predictive methods, design of experiments, reliability
• High current and high voltage or extremely high voltage: impact on packaging technologies

The abstract submission deadline is August 31st.Following the first workshop day, IMAPS will organize in the evening a specific event followed by a diner.  For further information, please contact by E-mail: imaps.france@orange.fr