RaMPoP Conference

The RF, Microwave and Photonics Packaging (RaMPoP) Conference 2026 will take place on November 26, 2026, at the Compound Semiconductor Applications Catapult in Newport, United Kingdom. Organized by IMAPS-UK, the conference brings together researchers, engineers, technology developers, equipment and material suppliers, and industry experts to discuss the latest developments, challenges, and innovations in advanced packaging for RF, microwave, and photonics applications.

As operating frequencies extend into the millimeter-wave and sub-terahertz ranges and electronic and optical technologies become increasingly integrated, advanced packaging plays a crucial role in ensuring device performance, reliability, manufacturability, and cost efficiency. The conference will explore how innovative assembly, interconnection, and packaging technologies can address these challenges and enable the next generation of high-frequency and photonic systems.

The technical programme will focus on four key areas:

• High-Frequency Packaging: New opportunities in packaging and integration for millimeter-wave and sub-terahertz devices, antenna systems, and high-power phased arrays.
• Photonics and Co-Packaged Optics: Silicon photonics, hybrid integration, and advanced packaging solutions for optical technologies and sensing applications.
• Advanced Interconnect Technologies: Innovative approaches to glass interposers, laser-fabricated vias, ultra-precise dispensing, and three-dimensional metallization.
• Testing and Measurement: Bridging the gap between multiphysics design, measurement, and characterization in RF, microwave, and photonics packaging.

The programme will feature expert presentations from leading academic institutions and industry representatives, complemented by a table-top exhibition, poster presentations, and networking opportunities. Participants will have the opportunity to exchange knowledge, discover emerging technologies, and establish connections across the microelectronics and photonics packaging community.

The conference will conclude with an opportunity to tour the Semiconductor Catapult facilities.

A Microelectronics Packaging Workshop will also take place on November 25, 2026, offering additional insights into essential packaging processes, including wafer preparation, die attach, interconnection, encapsulation, testing, and inspection.