This Semiconductor Packaging Workshop on 11 February 2021 brings together an array of electronics packaging experts and practitioners to present a comprehensive review of key semiconductor packaging technologies including die preparation, attach and interconnection techniques, package, substrate and encapsulation options, modelling and simulation and test, inspection and reliability.
The event provides training for staff who need to be aware of the benefits of employing basic packaging technologies for the design and manufacture of electronic products. It will also serve as a refresher for those who wish to expand the breadth of their knowledge and build their network of contacts in the field of electronic packaging.
“The Semiconductor Packaging Online Workshop” includes a Packaging Surgery, where industry experts will discuss any relevant packaging issues raised by delegates attending the event.
You can download the event flyer here.
The event will take place on 11 February 2021 from 9:30 am to 4:00 pm and it is open to all, including non IMAPS-UK members, the following delegate rates apply (net prices):
When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials . The event presentations and audio/visual will be available to registered attendees.
For further information, please contact IMAPS-UK: + 44 (0)131 202 9004 or email@example.com.