“Advanced SiP technology” is an umbrella term to cover a variety of SiP subsets, such as laminate/glass/ ceramic/silicon/leadframe based SiP, Fanout SiP, Heterogeneous integration, 2.5D/3D SiP and modules. Advanced SiP 2022 covers two major segments: microelectronic system design and system integration in a package.
The current trend is to integrate a full system or subsystem in an extremely miniaturized, smaller volume package structure with high functioning system performance, mechanical reliability, thermal management and high yield manufacturability.
Featuring two and a half days of technical sessions, panel discussions, exhibits and local networking activities, Advanced SiP 2022 will provide dynamic learning and technology updates on SiP trends and new engineering innovations from the industry‘s global SiP leaders. Speaking and presenting opportunities are by invitation from the technical committee. The program is currently in development and will be released this spring!
Registration for Advanced SIP Conference 2022 will open soon, including sponsorship and exhibit opportunities.