The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies.
This international conference features ceramic technology for both microsystems and interconnect applications in a multi-track technical program.
The Ceramic Interconnect track focuses on cost effective and reliable high-performance ceramic interconnect products for extreme environments in the automotive, aerospace, lighting, solar, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Multilayer ceramic, thin film, tape casting, thick film hybrid, direct write, and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design, and application opportunities.
Go to https://www.conftool.net/cicmt2022 to submit your 500+ word abstract!
The submission deadline is March 18, 2022. For further details please download the Call for Papers.
CICMT 2022 is expected to return as an on-site event. As an exhibitor, you will have the unique opportunity to market your products and services to a captive audience of buyers, designers, and influential researchers.
Our opening hours are arranged to give exhibitors maximum exposure, and coffee breaks are planned in the exhibition space to encourages all delegates to meet and mingle formally and informally. Spaces are available on a first-come-first-served basis. We will try to accommodate all of your special needs and requests.
Details about options and fees will be available shortly.