The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two […]
Hotels & Aktivitäten JOYN Vienna Karl-Popper-Straße 6, 1100 Wien, Österreich (18 Minuten zu Fuß) Für Tagungsgäste sind 10 Einzel- und Doppelzimmer zum Preis von 109,00€ […]
It is our pleasure to announce that the IMAPS Nordic & IEEE EPS Nordic 2022 Conference on Microelectronics Packaging (NordPac) will be held on-site between the […]
IMAPS-UK’s IPower3 Conference on Electronic Packaging for Net Zero will take place at the Advanced Propulsion Centre at the University of Warwick, near Coventry in a […]
Vom 14.06. bis 15.06.2022 öffnet in der Schwabenhalle Fellbach die 11. DVS/GMM Fachtagung ihre Tore. Unter dem Motto „Elktronische Baugruppen und Leiterplatten – Intelligentes Design, Intelligente […]
The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics […]
Nach dem Erfolg des Power Electronics Workshops, der in den letzten 11 Jahren zusammen mit der Universität und der polytechnischen Hochschule von Tours organisiert wurde, freut […]
A group of university teachers led by the Speaker has been working on various types of web-based education materials for many years. These materials are more […]
The reliability of micro-electro-mechanical-systems (MEMS) microphones has increased over recent decades. An essential capability for modern electronics systems, including MEMS, is to have access to test […]
Die Herbstkonferenz der IMAPS Deutschland gilt als wichtige Plattform für fachliche Diskussionen zwischen Industrie und Hochschule sowie Produktion und Forschung, um den Wirtschaftsstandort Deutschland weiter zu […]
The 54th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The Symposium will feature 5 technical tracks, plus our Interactive Poster […]