Mai 28, 2020
IMAPS-UK will hold a free one day online conference on May 28, 2020 on the topic of Power and High Temperature, where you can learn about […]
Mai 28, 2020
This is the fourth in a series of fundamentals of electronics packaging tutorials organised by IMAPS-UK to describe various aspects of the production of microelectronic assemblies. […]
Mai 14, 2020
IMAPS established the Advanced System-in-Package conference to focus exclusively on innovative SiP technology developments, solutions and business trends. Advanced SiP 2021 combines the IMAPS System-in Package […]
Mai 14, 2020
The 17th Annual Device Packaging Conference will be held online on April 12-15, 2021. It is an international event organized by the International Microelectronics Assembly and […]
März 31, 2020
IMAPS-UK will hold a free one day Online Conference on May 28th on the topic of Power and High Temperature, where you can learn about the […]
März 25, 2020
For the sixth time, Fraunhofer IZM is organizing the world’s largest conference on the environment in electronics under the title “Electronics Goes Green” (EGG). This year’s […]
Februar 4, 2020
Das Symposium Elektronik und Systemintegration ESI 2022, organisiert vom Cluster Mikrosystemtechnik der Hochschule Landshut und unterstützt von IMAPS Deutschland, findet am 6. April im Online-Formal statt. […]
Dezember 9, 2019
IMAPS Deutschland kooperiert bereits zum dritten Mal mit der SMTconnect. Von allen europäischen Messen ist die SMTconnect diejenige, die uns thematisch am engsten verbunden ist und […]
Oktober 31, 2019
ABGESAGT Wie in der Vergangenheit beginnt das IMAPS-Jahr traditionell mit der Frühjahrkonferenz, die unter dem Titel „MikroSystemIntegration – grenzenlose Vielfalt!“ am 18. März 2020 an der […]
Oktober 30, 2019
The 53rd International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2020 Technical Committee seeks original papers […]
Oktober 30, 2019
The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two […]
Oktober 29, 2019
The Advanced Power Electronics Packaging Symposium, which will be held online from April 26 to 29, 2021, specifically addresses current market needs and corresponding technical developments […]